All rights reserved.

This code is under development and not yet released to the public.
Until it is released, the code is under the copyright of ETH Zurich and
the University of Bologna, and may contain confidential and/or unpublished
work. Any reuse/redistribution is strictly forbidden without written
permission from ETH Zurich.
Bug fixes and contributions will eventually be released under the
SolderPad open hardware license in the context of the PULP platform
(http://www.pulp-platform.org), under the copyright of ETH Zurich and the
University of Bologna.