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52 commits

Author SHA1 Message Date
Sachin Kamat
45c396ce6b usb: dwc3: Remove duplicate header file inclusion 
module.h header file was included twice.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
 2012-06-22 13:21:43 +03:00
Anton Tikhomirov
d28a9689c9 usb: dwc3: Add Exynos Specific Glue layer 
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
 2012-03-02 12:11:28 +02:00