Add SolderPad Hardware License

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LICENSE
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All rights reserved. SOLDERPAD HARDWARE LICENSE version 0.51
This code is under development and not yet released to the public. This license is based closely on the Apache License Version 2.0, but is not
Until it is released, the code is under the copyright of ETH Zurich and approved or endorsed by the Apache Foundation. A copy of the non-modified
the University of Bologna, and may contain confidential and/or unpublished Apache License 2.0 can be found at http://www.apache.org/licenses/LICENSE-2.0.
work. Any reuse/redistribution is strictly forbidden without written
permission from ETH Zurich. As this license is not currently OSI or FSF approved, the Licensor permits any
Bug fixes and contributions will eventually be released under the Work licensed under this License, at the option of the Licensee, to be treated
SolderPad open hardware license in the context of the PULP platform as licensed under the Apache License Version 2.0 (which is so approved).
(http://www.pulp-platform.org), under the copyright of ETH Zurich and the
University of Bologna. This License is licensed under the terms of this License and in particular
clause 7 below (Disclaimer of Warranties) applies in relation to its use.
TERMS AND CONDITIONS FOR USE, REPRODUCTION, AND DISTRIBUTION
1. Definitions.
“License” shall mean the terms and conditions for use, reproduction, and
distribution as defined by Sections 1 through 9 of this document.
“Licensor” shall mean the Rights owner or entity authorized by the Rights owner
that is granting the License.
“Legal Entity” shall mean the union of the acting entity and all other entities
that control, are controlled by, or are under common control with that entity.
For the purposes of this definition, “control” means (i) the power, direct or
indirect, to cause the direction or management of such entity, whether by
contract or otherwise, or (ii) ownership of fifty percent (50%) or more of the
outstanding shares, or (iii) beneficial ownership of such entity.
“You” (or “Your”) shall mean an individual or Legal Entity exercising
permissions granted by this License.
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registered or unregistered), semiconductor topography (mask) rights and
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but not limited to source code, net lists, board layouts, CAD files,
documentation source, and configuration files.
“Object” form shall mean any form resulting from mechanical transformation or
translation of a Source form, including but not limited to compiled object
code, generated documentation, the instantiation of a hardware design and
conversions to other media types, including intermediate forms such as
bytecodes, FPGA bitstreams, artwork and semiconductor topographies (mask
works).
“Work” shall mean the work of authorship, whether in Source form or other
Object form, made available under the License, as indicated by a Rights notice
that is included in or attached to the work (an example is provided in the
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executed with Licensor regarding such Contributions.
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writing, Licensor provides the Work (and each Contributor provides its
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KIND, either express or implied, including, without limitation, any warranties
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tort (including negligence), contract, or otherwise, unless required by
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END OF TERMS AND CONDITIONS

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Matthias Baer <baermatt@student.ethz.ch> // Author: Matthias Baer <baermatt@student.ethz.ch>
// Author: Igor Loi <igor.loi@unibo.it> // Author: Igor Loi <igor.loi@unibo.it>
// Author: Andreas Traber <atraber@student.ethz.ch> // Author: Andreas Traber <atraber@student.ethz.ch>
@ -6,22 +16,7 @@
// //
// Date: 19.03.2017 // Date: 19.03.2017
// Description: Ariane ALU // Description: Ariane ALU
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module alu module alu

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 19.03.2017 // Date: 19.03.2017
// Description: Ariane Top-level module // Description: Ariane Top-level module
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
`ifndef verilator `ifndef verilator
`ifndef SYNTHESIS `ifndef SYNTHESIS

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 09.05.2017 // Date: 09.05.2017
// Description: Branch target calculation and comparison // Description: Branch target calculation and comparison
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module branch_unit ( module branch_unit (

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 19.04.2017 // Date: 19.04.2017
// Description: Branch Target Buffer implementation // Description: Branch Target Buffer implementation
// //
// Copyright (C) 2017 ETH Zurich, University of Bologna // Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved. // All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module btb #( module btb #(

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/* File: cache_ctrl.svh // Copyright 2018 ETH Zurich and University of Bologna.
* Author: Florian Zaruba <zarubaf@ethz.ch> // Copyright and related rights are licensed under the Solderpad Hardware
* Date: 14.10.2017 // License, Version 0.51 (the “License”); you may not use this file except in
* // compliance with the License. You may obtain a copy of the License at
* Copyright (C) 2017 ETH Zurich, University of Bologna // http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
* All rights reserved. // or agreed to in writing, software, hardware and materials distributed under
* // this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
* Description: Cache controller // CONDITIONS OF ANY KIND, either express or implied. See the License for the
*/ // specific language governing permissions and limitations under the License.
//
// File: cache_ctrl.svh
// Author: Florian Zaruba <zarubaf@ethz.ch>
// Date: 14.10.2017
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// Description: Cache controller
import ariane_pkg::*; import ariane_pkg::*;
import nbdcache_pkg::*; import nbdcache_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 15.04.2017 // Date: 15.04.2017
// Description: Commits to the architectural state resulting from the scoreboard. // Description: Commits to the architectural state resulting from the scoreboard.
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module commit_stage ( module commit_stage (

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//////////////////////////////////////////////////////////////////////////////// // Copyright 2018 ETH Zurich and University of Bologna.
// Copyright (C) 2017 ETH Zurich, University of Bologna // // Copyright and related rights are licensed under the Solderpad Hardware
// All rights reserved. // // License, Version 0.51 (the “License”); you may not use this file except in
// // // compliance with the License. You may obtain a copy of the License at
// This code is under development and not yet released to the public. // // http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// Until it is released, the code is under the copyright of ETH Zurich // // or agreed to in writing, software, hardware and materials distributed under
// and the University of Bologna, and may contain unpublished work. // // this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// Any reuse/redistribution should only be under explicit permission. // // CONDITIONS OF ANY KIND, either express or implied. See the License for the
// // // specific language governing permissions and limitations under the License. //
// Bug fixes and contributions will eventually be released under the // //
// SolderPad open hardware license and under the copyright of ETH Zurich // // Engineer: Sven Stucki - svstucki@student.ethz.ch
// and the University of Bologna. // //
// // // Design Name: Compressed instruction decoder
// Engineer: Sven Stucki - svstucki@student.ethz.ch // // Project Name: zero-riscy
// // // Language: SystemVerilog
// Design Name: Compressed instruction decoder // //
// Project Name: zero-riscy // // Description: Decodes RISC-V compressed instructions into their RV32
// Language: SystemVerilog // // equivalent. This module is fully combinatorial.
// //
// Description: Decodes RISC-V compressed instructions into their RV32 //
// equivalent. This module is fully combinatorial. //
// //
////////////////////////////////////////////////////////////////////////////////
import ariane_pkg::*; import ariane_pkg::*;

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@ -1,21 +1,16 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 08.05.2017 // Date: 08.05.2017
// Description: Flush controller // Description: Flush controller
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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@ -1,23 +1,18 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 05.05.2017 // Date: 05.05.2017
// Description: Buffer to hold CSR address, this acts like a functional unit // Description: Buffer to hold CSR address, this acts like a functional unit
// to the scoreboard. // to the scoreboard.
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module csr_buffer ( module csr_buffer (
@ -85,4 +80,4 @@ module csr_buffer (
end end
end end
endmodule endmodule

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@ -1,22 +1,17 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 05.05.2017 // Date: 05.05.2017
// Description: CSR Register File as specified by RISC-V // Description: CSR Register File as specified by RISC-V
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module csr_regfile #( module csr_regfile #(

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@ -1,22 +1,17 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 29.06.2017 // Date: 29.06.2017
// Description: Memory Mapped Debug Unit // Description: Memory Mapped Debug Unit
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module debug_unit ( module debug_unit (

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@ -1,13 +1,23 @@
/* File: issue_read_operands.sv // Copyright 2018 ETH Zurich and University of Bologna.
* Author: Florian Zaruba <zarubaf@ethz.ch> // Copyright and related rights are licensed under the Solderpad Hardware
* Date: 8.4.2017 // License, Version 0.51 (the “License”); you may not use this file except in
* // compliance with the License. You may obtain a copy of the License at
* Copyright (C) 2017 ETH Zurich, University of Bologna // http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
* All rights reserved. // or agreed to in writing, software, hardware and materials distributed under
* // this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
* Description: Issues instruction from the scoreboard and fetches the operands // CONDITIONS OF ANY KIND, either express or implied. See the License for the
* This also includes all the forwarding logic // specific language governing permissions and limitations under the License.
*/ //
// File: issue_read_operands.sv
// Author: Florian Zaruba <zarubaf@ethz.ch>
// Date: 8.4.2017
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// Description: Issues instruction from the scoreboard and fetches the operands
// This also includes all the forwarding logic
//
import ariane_pkg::*; import ariane_pkg::*;
module decoder ( module decoder (

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@ -1,22 +1,18 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 19.04.2017 // Date: 19.04.2017
// Description: Instantiation of all functional units residing in the execute stage // Description: Instantiation of all functional units residing in the execute stage
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module ex_stage #( module ex_stage #(

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 14.05.2017 // Date: 14.05.2017
// Description: Dual Port fetch FIFO with instruction aligner and support for compressed instructions // Description: Dual Port fetch FIFO with instruction aligner and support for compressed instructions
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 24.4.2017 // Date: 24.4.2017
// Description: Generic FIFO implementation // Description: Generic FIFO implementation
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
module fifo #( module fifo #(
parameter type dtype = logic[63:0], parameter type dtype = logic[63:0],
parameter int unsigned DEPTH = 4 parameter int unsigned DEPTH = 4

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 15.04.2017 // Date: 15.04.2017
// Description: Description: Instruction decode, contains the logic for decode, // Description: Description: Instruction decode, contains the logic for decode,
// issue and read operands. // issue and read operands.
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module id_stage ( module id_stage (

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 14.05.2017 // Date: 14.05.2017
// Description: Instruction fetch stage // Description: Instruction fetch stage
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module if_stage ( module if_stage (

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 14.05.2017 // Date: 14.05.2017
// Description: Emits and re-aligns compressed and unaligned instructions // Description: Emits and re-aligns compressed and unaligned instructions
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module instr_realigner ( module instr_realigner (

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 08.04.2017 // Date: 08.04.2017
// Description: Issues instruction from the scoreboard and fetches the operands // Description: Issues instruction from the scoreboard and fetches the operands
// This also includes all the forwarding logic // This also includes all the forwarding logic
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module issue_read_operands ( module issue_read_operands (

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 21.05.2017 // Date: 21.05.2017
// Description: Issue stage dispatches instructions to the FUs and keeps track of them // Description: Issue stage dispatches instructions to the FUs and keeps track of them
// in a scoreboard like data-structure. // in a scoreboard like data-structure.
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 22.05.2017 // Date: 22.05.2017
// Description: Load Unit, takes care of all load requests // Description: Load Unit, takes care of all load requests
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 19.04.2017 // Date: 19.04.2017
// Description: Load Store Unit, handles address calculation and memory interface signals // Description: Load Store Unit, handles address calculation and memory interface signals
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module lsu #( module lsu #(

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 22.05.2017 // Date: 22.05.2017
// Description: Arbitrates the LSU result port // Description: Arbitrates the LSU result port
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich
// Date: 12.11.2017
// Description: Handles cache misses.
// -------------- // --------------
// MISS Handler // MISS Handler
// -------------- // --------------
//
// Description: Handles cache misses.
//
import nbdcache_pkg::*; import nbdcache_pkg::*;
module miss_handler #( module miss_handler #(

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 19/04/2017 // Date: 19/04/2017
// Description: Memory Management Unit for Ariane, contains TLB and // Description: Memory Management Unit for Ariane, contains TLB and
// address translation unit. SV39 as defined in RISC-V // address translation unit. SV39 as defined in RISC-V
// privilege specification 1.11-WIP // privilege specification 1.11-WIP
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba <zarubaf@iis.ee.ethz.ch> // Author: Florian Zaruba <zarubaf@iis.ee.ethz.ch>
// Author: Pasquale Davide Schiavone <pschiavo@iis.ee.ethz.ch>
// //
// Date: 05.06.2017 // Date: 05.06.2017
// Description: Ariane Multiplier // Description: Ariane Multiplier
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 13.10.2017 // Date: 13.10.2017
// Description: Nonblocking private L1 dcache // Description: Nonblocking private L1 dcache
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
import ariane_pkg::*; import ariane_pkg::*;
import nbdcache_pkg::*; import nbdcache_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 20.04.2017 // Date: 20.04.2017
// Description: PC generation stage // Description: PC generation stage
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 06.10.2017 // Date: 06.10.2017
// Description: Performance counters // Description: Performance counters
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module perf_counters #( module perf_counters #(

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// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: David Schaffenrath, TU Graz // Author: David Schaffenrath, TU Graz
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 24.4.2017 // Date: 24.4.2017
// Description: Hardware-PTW // Description: Hardware-PTW
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
/* verilator lint_off WIDTH */ /* verilator lint_off WIDTH */
import ariane_pkg::*; import ariane_pkg::*;

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@ -1,31 +1,27 @@
//////////////////////////////////////////////////////////////////////////////// // Copyright 2018 ETH Zurich and University of Bologna.
// Copyright (C) 2017 ETH Zurich, University of Bologna // // Copyright and related rights are licensed under the Solderpad Hardware
// All rights reserved. // // License, Version 0.51 (the “License”); you may not use this file except in
// // // compliance with the License. You may obtain a copy of the License at
// This code is under development and not yet released to the public. // // http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// Until it is released, the code is under the copyright of ETH Zurich // // or agreed to in writing, software, hardware and materials distributed under
// and the University of Bologna, and may contain unpublished work. // // this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// Any reuse/redistribution should only be under explicit permission. // // CONDITIONS OF ANY KIND, either express or implied. See the License for the
// // // specific language governing permissions and limitations under the License.
// Bug fixes and contributions will eventually be released under the // //
// SolderPad open hardware license and under the copyright of ETH Zurich // // Author: Antonio Pullini - pullinia@iis.ee.ethz.ch
// and the University of Bologna. // //
// // // Additional contributions by:
// Engineer: Antonio Pullini - pullinia@iis.ee.ethz.ch // // Sven Stucki - svstucki@student.ethz.ch
// // // Markus Wegmann - markus.wegmann@technokrat.ch
// Additional contributions by: // //
// Sven Stucki - svstucki@student.ethz.ch // // Design Name: RISC-V register file
// Markus Wegmann - markus.wegmann@technokrat.ch // // Project Name: zero-riscy
// // // Language: SystemVerilog
// Design Name: RISC-V register file // //
// Project Name: zero-riscy // // Description: Register file with 31 or 15x 32 bit wide registers.
// Language: SystemVerilog // // Register 0 is fixed to 0. This register file is based on
// // // latches and is thus smaller than the flip-flop based RF.
// Description: Register file with 31 or 15x 32 bit wide registers. // //
// Register 0 is fixed to 0. This register file is based on //
// latches and is thus smaller than the flip-flop based RF. //
// //
////////////////////////////////////////////////////////////////////////////////
module regfile module regfile
#( #(

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@ -1,30 +1,26 @@
//////////////////////////////////////////////////////////////////////////////// // Copyright 2018 ETH Zurich and University of Bologna.
// Copyright (C) 2017 ETH Zurich, University of Bologna // // Copyright and related rights are licensed under the Solderpad Hardware
// All rights reserved. // // License, Version 0.51 (the “License”); you may not use this file except in
// // // compliance with the License. You may obtain a copy of the License at
// This code is under development and not yet released to the public. // // http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// Until it is released, the code is under the copyright of ETH Zurich // // or agreed to in writing, software, hardware and materials distributed under
// and the University of Bologna, and may contain unpublished work. // // this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// Any reuse/redistribution should only be under explicit permission. // // CONDITIONS OF ANY KIND, either express or implied. See the License for the
// // // specific language governing permissions and limitations under the License.
// Bug fixes and contributions will eventually be released under the // //
// SolderPad open hardware license and under the copyright of ETH Zurich // // Engineer: Francesco Conti - f.conti@unibo.it
// and the University of Bologna. // //
// // // Additional contributions by:
// Engineer: Francesco Conti - f.conti@unibo.it // // Markus Wegmann - markus.wegmann@technokrat.ch
// // //
// Additional contributions by: // // Design Name: RISC-V register file
// Markus Wegmann - markus.wegmann@technokrat.ch // // Project Name: zero-riscy
// // // Language: SystemVerilog
// Design Name: RISC-V register file // //
// Project Name: zero-riscy // // Description: Register file with 31 or 15x 32 bit wide registers.
// Language: SystemVerilog // // Register 0 is fixed to 0. This register file is based on
// // // flip flops.
// Description: Register file with 31 or 15x 32 bit wide registers. // //
// Register 0 is fixed to 0. This register file is based on //
// flip flops. //
// //
////////////////////////////////////////////////////////////////////////////////
module regfile module regfile
#( #(

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@ -1,22 +1,16 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 08.04.2017 // Date: 08.04.2017
// Description: Scoreboard - keeps track of all decoded, issued and committed instructions // Description: Scoreboard - keeps track of all decoded, issued and committed instructions
//
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;

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@ -1,22 +1,17 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 25.04.2017 // Date: 25.04.2017
// Description: Store queue persists store requests and pushes them to memory // Description: Store queue persists store requests and pushes them to memory
// if they are no longer speculative // if they are no longer speculative
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
module store_buffer ( module store_buffer (
input logic clk_i, // Clock input logic clk_i, // Clock

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@ -1,20 +1,16 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 22.05.2017 // Date: 22.05.2017
// Description: Store Unit, takes care of all store requests // Description: Store Unit, takes care of all store requests
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
import ariane_pkg::*; import ariane_pkg::*;

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@ -1,23 +1,19 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
//
// Author: David Schaffenrath, TU Graz // Author: David Schaffenrath, TU Graz
// Author: Florian Zaruba, ETH Zurich // Author: Florian Zaruba, ETH Zurich
// Date: 21.4.2017 // Date: 21.4.2017
// Description: Translation Lookaside Buffer, SV39 // Description: Translation Lookaside Buffer, SV39
// fully set-associative // fully set-associative
//
// Copyright (C) 2017 ETH Zurich, University of Bologna
// All rights reserved.
//
// This code is under development and not yet released to the public.
// Until it is released, the code is under the copyright of ETH Zurich and
// the University of Bologna, and may contain confidential and/or unpublished
// work. Any reuse/redistribution is strictly forbidden without written
// permission from ETH Zurich.
//
// Bug fixes and contributions will eventually be released under the
// SolderPad open hardware license in the context of the PULP platform
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
// University of Bologna.
//
import ariane_pkg::*; import ariane_pkg::*;
module tlb #( module tlb #(

2
tb

@ -1 +1 @@
Subproject commit e6e142e7593c4387c7f06c919980f86a8cd8e7e5 Subproject commit 8f1939982f58bbdc0aa8def5e641c25247ec2fb0