Merge remote-tracking branch 'origin' into new_intc2

This commit is contained in:
Pasquale Davide Schiavone 2017-09-06 16:42:15 +02:00
commit 22dd8f3ce0
23 changed files with 205 additions and 240 deletions

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@ -1,17 +1,18 @@
# **zero-riscy**: RISC-V Core
# zero-riscy: RISC-V Core
**zero-riscy** is a small 2-stage RISC-V core derived from RI5CY.
*zero-riscy** is a small 2-stage RISC-V core derived from RI5CY.
**zero-riscy** fully implements the RV32IMC instruction set and a minimal set of RISCV privileged v1.9 specifications.
**zero-riscy** fully implements the RV32IMC instruction set and a minimal
set of RISCV privileged specifications.
**zero-riscy** can be configured to be very small by disabling the RV32M extensions
and by activating the RV32E extensios. This configuration is called **micro-riscy**
In particular, **zero-riscy** supports the following machine-level CSR addresses: mhartid, mepc, mcause and the MIE/MPIE fields of the mstatus.
The core was developed as part of the [PULP platform](http://pulp.ethz.ch/) for
energy-efficient computing and is currently used as the control core for
PULP and PULPino.
**zero-riscy** supports debug. The debug unit has been ported from RI5CY and it has the same specifications reported in http://www.pulp-platform.org/wp-content/uploads/2017/02/ri5cy_user_manual.pdf at page 26.
**zero-riscy** can be configured to be very small by disabling the RV32M extensions and by activating the RV32E extensios.
Roadmap for future features includes:
Supports for performance counters.
## Documentation
A datasheet that explains the most important features of the core can be found
in the `zeroriscy-doc` repository.

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// Copyright 2015 ETH Zurich and University of Bologna.
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at

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@ -1,4 +1,4 @@
// Copyright 2015 ETH Zurich and University of Bologna.
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
@ -8,7 +8,6 @@
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
package zeroriscy_tracer_defines;
import zeroriscy_defines::*;

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@ -38,6 +38,7 @@ zeroriscy_regfile_rtl:
targets: [
rtl,
tsmc55,
gf22
]
incdirs: [
include,

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// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Markus Wegmann - markus.wegmann@technokrat.ch //
// //

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@ -1,15 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Sven Stucki - svstucki@student.ethz.ch //
// //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Matthias Baer - baermatt@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Matthias Baer - baermatt@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Sven Stucki - svstucki@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer Andreas Traber - atraber@iis.ee.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Renzo Andri - andrire@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
// //
// Design Name: Fetch Fifo for 32 bit memory interface //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Renzo Andri - andrire@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// ///
// Engineer: Renzo Andri - andrire@student.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Igor Loi - igor.loi@unibo.it //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
// //
// //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
// //
// //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
// //
// Design Name: Prefetcher Buffer for 32 bit memory interface //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Antonio Pullini - pullinia@iis.ee.ethz.ch //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Francesco Conti - f.conti@unibo.it //
// //
// Additional contributions by: //

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@ -1,16 +1,14 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Copyright (C) 2017 ETH Zurich, University of Bologna //
// All rights reserved. //
// //
// This code is under development and not yet released to the public. //
// Until it is released, the code is under the copyright of ETH Zurich //
// and the University of Bologna, and may contain unpublished work. //
// Any reuse/redistribution should only be under explicit permission. //
// //
// Bug fixes and contributions will eventually be released under the //
// SolderPad open hardware license and under the copyright of ETH Zurich //
// and the University of Bologna. //
// //
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
// //
// Additional contributions by: //