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SolderPad Header
This commit is contained in:
parent
00f24db779
commit
edf308df16
21 changed files with 189 additions and 294 deletions
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
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* All rights reserved.
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||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
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||||
*/
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||||
// Copyright 2017 ETH Zurich and University of Bologna.
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||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
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||||
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////////////////////////////////////////////////////////////////////////////////
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// Engineer: Michael Gautschi - gautschi@iis.ee.ethz.ch //
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@ -1,17 +1,12 @@
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|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
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||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
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||||
// Engineer: Matthias Baer - baermatt@student.ethz.ch //
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||||
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@ -1,17 +1,12 @@
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|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
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||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
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||||
*/
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||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
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||||
package zeroriscy_tracer_defines;
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import zeroriscy_defines::*;
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@ -1,17 +1,12 @@
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|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
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||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
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||||
// //
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||||
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|
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@ -1,17 +1,12 @@
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|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
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||||
// //
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||||
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@ -1,17 +1,12 @@
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|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Matthias Baer - baermatt@student.ethz.ch //
|
||||
|
|
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@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Matthias Baer - baermatt@student.ethz.ch //
|
||||
|
|
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@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Sven Stucki - svstucki@student.ethz.ch //
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||||
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|
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@ -1,17 +1,12 @@
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
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||||
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|
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@ -1,17 +1,12 @@
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer Andreas Traber - atraber@iis.ee.ethz.ch //
|
||||
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|
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@ -1,17 +1,12 @@
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Renzo Andri - andrire@student.ethz.ch //
|
||||
|
|
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@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Renzo Andri - andrire@student.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Renzo Andri - andrire@student.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Igor Loi - igor.loi@unibo.it //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Antonio Pullini - pullinia@iis.ee.ethz.ch //
|
||||
|
|
|
@ -1,17 +1,12 @@
|
|||
/* Copyright (C) 2017 ETH Zurich, University of Bologna
|
||||
* All rights reserved.
|
||||
*
|
||||
* This code is under development and not yet released to the public.
|
||||
* Until it is released, the code is under the copyright of ETH Zurich and
|
||||
* the University of Bologna, and may contain confidential and/or unpublished
|
||||
* work. Any reuse/redistribution is strictly forbidden without written
|
||||
* permission from ETH Zurich.
|
||||
*
|
||||
* Bug fixes and contributions will eventually be released under the
|
||||
* SolderPad open hardware license in the context of the PULP platform
|
||||
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
|
||||
* University of Bologna.
|
||||
*/
|
||||
// Copyright 2017 ETH Zurich and University of Bologna.
|
||||
// Copyright and related rights are licensed under the Solderpad Hardware
|
||||
// License, Version 0.51 (the “License”); you may not use this file except in
|
||||
// compliance with the License. You may obtain a copy of the License at
|
||||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
|
||||
// or agreed to in writing, software, hardware and materials distributed under
|
||||
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
|
||||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
|
||||
// specific language governing permissions and limitations under the License.
|
||||
|
||||
////////////////////////////////////////////////////////////////////////////////
|
||||
// Engineer: Francesco Conti - f.conti@unibo.it //
|
||||
|
|
Loading…
Add table
Add a link
Reference in a new issue