SolderPad Header

This commit is contained in:
Pasquale Davide Schiavone 2017-08-03 15:12:13 +02:00
parent 00f24db779
commit edf308df16
21 changed files with 189 additions and 294 deletions

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Michael Gautschi - gautschi@iis.ee.ethz.ch //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Matthias Baer - baermatt@student.ethz.ch //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
package zeroriscy_tracer_defines;
import zeroriscy_defines::*;

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Matthias Baer - baermatt@student.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Matthias Baer - baermatt@student.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Sven Stucki - svstucki@student.ethz.ch //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //

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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer Andreas Traber - atraber@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Renzo Andri - andrire@student.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Renzo Andri - andrire@student.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Renzo Andri - andrire@student.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Igor Loi - igor.loi@unibo.it //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Davide Schiavone - pschiavo@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Andreas Traber - atraber@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Antonio Pullini - pullinia@iis.ee.ethz.ch //

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@ -1,17 +1,12 @@
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
////////////////////////////////////////////////////////////////////////////////
// Engineer: Francesco Conti - f.conti@unibo.it //