Removed non-ASCII characters

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Francesco Conti 2018-01-29 22:05:44 +01:00
parent 71cb9878f4
commit b99e74ef26
23 changed files with 60 additions and 60 deletions

32
LICENSE
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@ -15,43 +15,43 @@ TERMS AND CONDITIONS FOR USE, REPRODUCTION, AND DISTRIBUTION
1. Definitions.
“License” shall mean the terms and conditions for use, reproduction, and
"License" shall mean the terms and conditions for use, reproduction, and
distribution as defined by Sections 1 through 9 of this document.
“Licensor” shall mean the Rights owner or entity authorized by the Rights owner
"Licensor" shall mean the Rights owner or entity authorized by the Rights owner
that is granting the License.
“Legal Entity” shall mean the union of the acting entity and all other entities
"Legal Entity" shall mean the union of the acting entity and all other entities
that control, are controlled by, or are under common control with that entity.
For the purposes of this definition, “control” means (i) the power, direct or
For the purposes of this definition, "control" means (i) the power, direct or
indirect, to cause the direction or management of such entity, whether by
contract or otherwise, or (ii) ownership of fifty percent (50%) or more of the
outstanding shares, or (iii) beneficial ownership of such entity.
“You” (or “Your”) shall mean an individual or Legal Entity exercising
"You" (or "Your") shall mean an individual or Legal Entity exercising
permissions granted by this License.
“Rights” means copyright and any similar right including design right (whether
"Rights" means copyright and any similar right including design right (whether
registered or unregistered), semiconductor topography (mask) rights and
database rights (but excluding Patents and Trademarks).
“Source” form shall mean the preferred form for making modifications, including
"Source" form shall mean the preferred form for making modifications, including
but not limited to source code, net lists, board layouts, CAD files,
documentation source, and configuration files.
“Object” form shall mean any form resulting from mechanical transformation or
"Object" form shall mean any form resulting from mechanical transformation or
translation of a Source form, including but not limited to compiled object
code, generated documentation, the instantiation of a hardware design and
conversions to other media types, including intermediate forms such as
bytecodes, FPGA bitstreams, artwork and semiconductor topographies (mask
works).
“Work” shall mean the work of authorship, whether in Source form or other
"Work" shall mean the work of authorship, whether in Source form or other
Object form, made available under the License, as indicated by a Rights notice
that is included in or attached to the work (an example is provided in the
Appendix below).
“Derivative Works” shall mean any work, whether in Source or Object form, that
"Derivative Works" shall mean any work, whether in Source or Object form, that
is based on (or derived from) the Work and for which the editorial revisions,
annotations, elaborations, or other modifications represent, as a whole, an
original work of authorship. For the purposes of this License, Derivative Works
@ -59,20 +59,20 @@ shall not include works that remain separable from, or merely link (or bind by
name) or physically connect to or interoperate with the interfaces of, the Work
and Derivative Works thereof.
“Contribution” shall mean any design or work of authorship, including the
"Contribution" shall mean any design or work of authorship, including the
original version of the Work and any modifications or additions to that Work or
Derivative Works thereof, that is intentionally submitted to Licensor for
inclusion in the Work by the Rights owner or by an individual or Legal Entity
authorized to submit on behalf of the Rights owner. For the purposes of this
definition, “submitted” means any form of electronic, verbal, or written
definition, "submitted" means any form of electronic, verbal, or written
communication sent to the Licensor or its representatives, including but not
limited to communication on electronic mailing lists, source code control
systems, and issue tracking systems that are managed by, or on behalf of, the
Licensor for the purpose of discussing and improving the Work, but excluding
communication that is conspicuously marked or otherwise designated in writing
by the Rights owner as “Not a Contribution.”
by the Rights owner as "Not a Contribution."
“Contributor” shall mean Licensor and any individual or Legal Entity on behalf
"Contributor" shall mean Licensor and any individual or Legal Entity on behalf
of whom a Contribution has been received by Licensor and subsequently
incorporated within the Work.
@ -112,7 +112,7 @@ Source or Object form, provided that You meet the following conditions:
the Source form of the Work, excluding those notices that do not pertain to
any part of the Derivative Works; and
If the Work includes a “NOTICE” text file as part of its distribution, then
If the Work includes a "NOTICE" text file as part of its distribution, then
any Derivative Works that You distribute must include a readable copy of
the attribution notices contained within such NOTICE file, excluding those
notices that do not pertain to any part of the Derivative Works, in at
@ -145,7 +145,7 @@ reproducing the content of the NOTICE file.
7. Disclaimer of Warranty. Unless required by applicable law or agreed to in
writing, Licensor provides the Work (and each Contributor provides its
Contributions) on an “AS IS” BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY
Contributions) on an "AS IS" BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY
KIND, either express or implied, including, without limitation, any warranties
or conditions of TITLE, NON-INFRINGEMENT, MERCHANTABILITY, or FITNESS FOR A
PARTICULAR PURPOSE. You are solely responsible for determining the

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@ -1,10 +1,10 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2017 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

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@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

View file

@ -1,10 +1,10 @@
// Copyright 2018 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// License, Version 0.51 (the "License"); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.